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MASW2040
GaAs DPDT Switch DC - 2.0 GHz
Features
* * * * * Cascadable Low Insertion Loss Low DC Power Consumption Low Distortion Operation (Quiet Mode) Useful as a Building Block for -Digital Attenuators -Digital Delay Lines -Digital Phase Shifters -Digital Switched Filter Elements Rev. V3
Pad Layout
RFA1
RFA2
Description
M/A-COM's MASW2040 is a GaAs MMIC DPDT switch die. The MASW2040 is ideally suited for use where low power consumption is required. Typical applications include transmit/receive switching, switch matrices, and switched filter banks in systems such as radio and cellular equipment, PCM, GPS, fiber optic modules, and other battery powered radio equipment.
RFB1 RFB2
Die Size--Inches (mm)
0.043 x 0.037 x 0.010 (1.10 x 0.94 x 0.25)
Ordering Information
Part Number
MASW2040
Bond Pad Dimensions
Package
DIE
Bond Pad
RF1, RF2 RFA1, RFB1
Dimensions - Inches (mm)
0.004 x 0.007 (0.102 x0.182) 0.005 x 0.004 (0.133 x 0.100) 0.005 x 0.004 (0.133 x 0.100) 0.004 x 0.004 (0.100 x 0.100)
Absolute Maximum Rating 1,2
Parameter
Control Value (A or B) Max Input RF Power Storage Temperature Max Operating Temperature
RFA2, RFB2 A, B, Ac, Bc
Absolute Maximum
-8.5 Vdc +34 dBm -65C to +175C +175C
Schematic
1. Exceeding any one or combination of these limits may cause permanent damage to this device. 2. M/A-COM does not recommend sustained operation near these survivability limits.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW2040
GaAs DPDT Switch DC - 2.0 GHz
Electrical Specifications: 0 / -5 Vdc, -55C to +85C
Parameter
Insertion Loss
Rev. V3
Test Conditions
DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz DC - 0.5 GHz DC - 1.0 GHz DC - 2.0 GHz 0.05 GHz (0 / -5 V, 0 / -8V) 0.5 - 2.0 GHz (0 / -5 V, 0 / -8V) Two Tone Input Power up to +5 dBm 0.05 GHz 0.5 - 2.0 GHz Two Tone Input Power up to +5 dBm 0.05 GHz 0.5 - 2.0 GHz VIN Low (0 to -0.2 V) VIN High (-5 V @ 25 A Typ to -8 V) 10% to 90% RF and 90% to 10% RF 50% control to 90% RF, and 50% control to 90% RF In Band
Units
dB dB dB dB dB dB Ratio Ratio Ratio dBm dBm dBm dBm dBm dBm A A ns ns mV
Min.
-- -- -- 25 20 15 -- -- -- -- -- -- -- -- -- -- -- -- -- --
Typ.
-- -- -- -- -- -- -- -- -- +24, +25 +30, +33 +62 +68 +39 +46 -- -- 3 6 20
Max.
0.4 0.4 0.6 -- -- -- 1.1:1 1.2:1 1.2:1 -- -- -- -- -- -- 9 75 -- -- --
Isolation
VSWR
Input P-1dB
IP2
IP3
Control Current T-rise, T-fall TON, TOFF Transients
Truth Table 3
Control A
1 0
Handling Procedures
Condition of Switch
Please observe the following precautions to avoid damage:
RF2RFB2
On Off
B
0 1
RF1RFA1
Off On
RF1RFB1
On Off
RF2RFA2
Off On
Static Sensitivity
Gallium Arsenide Integrated Circuits are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these devices.
3. 0 = 0 to -0.2 V, 1 = -5 V.
2
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW2040
GaAs DPDT Switch DC - 2.0 GHz
Typical Performance @ 25C
Insertion Loss vs. Frequency
1.0
Rev. V3
VSWR vs. Frequency
1.5
0.75
1.4
1.3
0.50
1.2
0.25
1.1
0.0 0.0
0.5
1.0
1.5
2.0
1.0 0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
Frequency (GHz)
Isolation vs. Frequency
40
30
20
10
0 0.0
0.5
1.0
1.5
2.0
Frequency (GHz)
3
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.
MASW2040
GaAs DPDT Switch DC - 2.0 GHz
Handling Precautions
Permanent damage to the MASW2040 may occur if the following precautions are not adhered to: A. Cleanliness - The MASW2040 should be handled in a clean environment. DO NOT attempt to clean unit after the MASW2040 is installed. B. Static Sensitivity - All chip handling equipment and personnel should be DC grounded. C. Transient - Avoid instrument and power supply transients while bias is applied to the MASW2040. Use shielded signal and bias cables to minimize inductive pick-up. D. Bias - Apply Voltage to either control port A or B only when the other is grounded. Neither port should be allowed to "float." E. General Handling - It is recommended that the MASW2040 chip be handled along the long side of the die with a sharp pair of bent tweezers. DO NOT touch the surface of the chip with fingers or tweezers. Rev. V3
Wire Bonding
A. Ball or wedge with 1.0 mil diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150C and a ball bonding force of 40 to 50 grams or wedge bonding force o1 18 to 22 grams is recommended. Ultrasonic energy and time should be adjusted to the minimum levels achieve reliable wirebonds. B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as possible; at least three and no more than four bond wires from ground pads to package are recommended.
Mounting
The MASW2040 is back-metallized with Pd/Ni/Au (100/1,000/10,000A) metallization. It can be diemounted with AuSn eutectic performs or with thermally conductive epoxy. The package surface should be clean and flat before attachment. Eutectic Die Attach: A. A 80/20 gold/tin preform is recommended with a work surface temperature of approximately 255C and a tool temperature of 265C. When not 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be approximately 290C. B. DO NOT expose the MASW2040 to a temperature greater than 320C for more than 20 seconds. No more than 3 seconds for scrubbing should be required for attachment. Epoxy Die Attach: A. Apply a minimum amount of epoxy and place the MASW2040 into position. A thin epoxy fillet should be visible around the perimeter of the chip. B. Cure epoxy per manufacturer's recommended schedule. C. Electrically conductive epoxy may be used by is not required.
4
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions * North America Tel: 800.366.2266 / Fax: 978.366.2266 is considering for development. Performance is based on target specifications, simulated results, * Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300 and/or prototype measurements. Commitment to develop is not guaranteed. * Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298 PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Visit www.macomtech.com for additional data sheets and product information. Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.

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